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solder paste 焊藥。

soldering iron

Established international trading company handling smt machineries like aoi , 3d solder paste inspector , screen printers , reflow ovens , wave soldering machines , x - ray , bga rework stations and thermal profilers . requires experience smt sales executives for north and south china market 上海地艾星國際貿易公司是專門從事smt設備進出口的國際貿易公司,并提供完善的技術支持和售后服務.主要設備包括光學檢查機, 3d焊錫膏檢查系統,絲網印刷機,回流爐,波峰焊, x光檢查機, bga返修臺以及測溫儀。

More than 2 years working experiences in electronics industry and sales and marketing experience in selling consumable materials as well as electronic tools including tapes , adhesive , insulation powder , solder pastes , tools , soldering stations , bench type rework stations and smt products is preferred 2年以上電子行業工作背景,有工業耗材及電子工具類產品(如工業膠帶、工業膠水、保護膜、焊錫膏、還氧粉、焊臺、返修工作臺、 smt產品等)銷售或市場營銷經驗者佳。

More than 3 years working experiences in electronics industry and sales and marketing experience in selling consumable materials as well as electronic tools including tapes , adhesives , insulation powder , solder pastes , tools , soldering stations , bench type rework stations and smt products is preferred 3年以上電子行業工作背景,有工業耗材及電子工具類產品(如工業膠帶、工業膠水、保護膜、焊錫膏、還氧粉、焊臺、返修工作臺、 smt產品等)銷售或市場營銷經驗者佳。

Spherical alloy solder powder producing by high - energy atomizing technique , under accurate monitoring by the computer , carrying out the high quality standard of the alloy solder powder , can satisfy with the high quality demand of the solder paste manufacture absolutely 采用高能霧化技術生產的球型合金焊錫粉,在計算機精確的控制下,執行高品質的合金焊粉質量標準,完全能滿足高品質錫膏制造的要求。

In the five key factors of solder ball alloy , solder paste alloy , peak temperature , the time above liquidus and soldering environment , the fore four factors are more important than soldering environment to the solder joints reliability 在焊球合金、焊料合金、峰值溫度、液相線以上時間和焊接環境五個關鍵因素中,前四項對焊點可靠性比較重要,焊接環境對焊點可靠性的影響不很顯著。

The characteristics of a solder paste plays a very important role in the surface mount assembly process therefore it is crucial to select a suitable paste in order to achieve consistent soldering results 焊膏的特性在整個設備裝配過程中起著重要作用,因此為了達到堅固的焊接效果選擇適當的焊膏是至關重要的。

With a change of stencil and perhaps an adaptation to the enclosed print head , a stencil printer may be used as needed to deposit solder paste , adhesive , flux , encapsulants or thermal interface materials 鋼網改變和調整至閉合印刷頭,鋼網印刷機用作錫膏印刷,紅膠水印刷,松香,密封劑或其他的熱表面材料。

In the beginning , “ i - hua trading co . , ltd . “ was engaged in promoting smt materials thru importing from japanese fuji chemical smd adhesives , shikoku smd adhesives and nihon superior solder pastes for local market 初期,宜樺貿易有限公司以推廣自日本進口之表面黏著技術所使用之接著劑及錫膏給國內廠家。

Lead - free n2 / air reflow soldering machine , automatic lead - free dual wave soldering machine , semi - auto solder paste printer , loader , unloader , buffer conveyor , multi - function buffer loader , aoi 熱風回流焊錫機,全自動無鉛雙波峰焊錫機,錫膏印刷機,送板機,收板機,緩沖輸送機,多功能暫存機, aoi等。

Lead - free n2 / air reflow soldering machine , automatic lead - free dual wave soldering machine , semi - auto solder paste printer , loader , unloader , buffer conveyor , ng / ok buffer loader 熱風回流焊錫機,全自動無鉛雙波峰焊錫機。錫膏印刷機,上板機,下板機,緩沖輸送機, ng / ok暫存機等。

Solder paste or wire , in varying sizes , rma fluxes , offering “ no - clean “ efficiency , and the latest technologies in the cutting edge lead - free range 焊錫膏和焊錫絲有多種規格可供選擇,免清洗助焊劑能使您的工作更加高效,在無鉛焊接領域,阿米特公司的技術更是居于世界領先水平。

Trough the experiment , we probed to the suited mount method ( mount with 183 soldering paste ) and bonding technique ( ball bonding with the gold silks of 18 m in diameter ) 通過實驗,探索出了合適的貼裝方式( 183焊膏貼裝)和管芯鍵合工藝(直徑18 m的金絲球焊) 。

And then take it from the refrigerator until the solder paste is back to the normal temperature with the sealed forms the operator may open it and use 錫膏從冰箱中取出時,應在其密封狀態下,回到室溫后再開封,然后放在攪拌機上充分攪拌,再加到網版上使用。

Attachment materials for electronic assembly - part 1 - 2 : requirements for solder pastes for high - quality interconnections in electronics assembly 電子組件用連接材料.第1 - 2部分:電子組件中高質量互連用焊膏的要求

Attachment materials for electronic assembly - part 1 - 2 : requirements for solder pastes for high - quality interconnections in electronics assembly 電子組件用連接材料.第1 - 2部分:電子組件中高質量互連用焊錫的要求

Smd environmental testing : tests - test : test methods for solderability of surface mounting devices by wetting balance using lead - free solder paste 環境試驗:試驗.試驗:用無鉛焊錫膏濕潤平衡法測定表面安裝裝置

Solvent may be easily vaporized when solder paste is contacted with air - conditioned current or wind and hence reducing its tackiness 不要將焊膏放近于風口的位置,因為這樣會使焊膏中的溶劑蒸發,降低其粘性。

From this information the volume of solder paste required can be calculated , which can in turn be used to design the aperture dimensions 由錫膏的用量(錫膏的用量可以計算出) ,可反過來用來設計孔的尺寸。

Do not touch solder paste bare - handed . remove with ethyl alcohol from body or clothes if contaminated by solder paste 小心使用焊膏,避免觸及皮膚。若附于衣服或身體時,應盡快用含有酒精的溶劑把焊膏抹掉。